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High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

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High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

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Brand Name : WINNER

Model Number : WGBW-111

Certification : ISO 9001, ISO 14001, RoHS

Place of Origin : China

MOQ : 1pc

Price : 1~999

Payment Terms : T/T, Western Union, L/C

Supply Ability : 1000000 rolls per month

Delivery Time : 5~8 working days.

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Purity : 99.99%

Material : Gold

Bonding Method : Ultrasonic, Thermocompression, Laser

Package : Spool, Reel, Coil

Application : Semiconductor Packaging

Product Type : Bonding Wire

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‌High Purity 0.01mm Gold Bonding Wire for Microscale Electronics‌

‌Our ‌ultra-fine gold bonding wire‌ (0.01mm diameter) delivers ‌99.99% purity‌, ideal for precision ‌microscale electronics‌, semiconductor packaging, and advanced MEMS devices. Engineered for ‌high conductivity‌, ‌low resistance‌, and ‌superior bond strength‌, this wire ensures reliable interconnections in ‌high-frequency circuits‌, ‌LEDs‌, and ‌medical microcomponents‌.
Key Features:‌
* ‌0.01mm Ultra-Thin Diameter‌ – Perfect for miniaturized electronic assemblies.
* ‌99.99% Pure Gold‌ – Minimizes oxidation and ensures stable signal transmission.
* Exceptional Ductility‌ – Reduces breakage during thermosonic or wedge bonding.
* ISO-Certified‌ – Complies with ‌RoHS‌ and ‌JIS Z 3284‌ standards.
‌Applications:‌
* Semiconductor die bonding‌
* Chip-on-board (COB) technology‌
* Hybrid circuit interconnects

Physical Properties

Density:
19.34 g/cm3
Melting Point:
1063°C
Electrical Resistivity: (@20°C)
2.3 μΩ-cm
Electrical Conductivity: (@20°C)
75% (IACS)
Thermal Conductivity: (@20°C)
315 W/(m-K)
Fusing Current (10 mm x 25 μm)
0.52 A
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
Composition
Diameter
Tensile Strength (gms)
Elongation (%)
99.99% Au
0.7 mil
17.5 μm
3 - 10
2 - 6
0.8 mil
20 μm
4 - 13
2 - 7
0.9 mil
22.5 μm
5 - 16
2 - 8
1.0 mil
25 μm
6 - 20
2 - 8
1.3 mil
32.5 μm
10 - 45
2 - 10
1.5 mil
37.5 μm
13 - 50
2 - 12
1.7 mil
42.5 μm
15 - 60
2 - 12
1.8 mil
45 μm
20 - 70
2 - 12
2.0 mil
50 μm
25 - 85
2 - 15
3.0 mil
75 μm
50 - 180
2 - 20
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics


China High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics factory

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics Images

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